Industry leading processes and tools for FA dry etch de-processing
Oxford Instruments' flexible Failure Analysis (FA) tools allow a whole range of processes, from passivation removal to anisotropic oxide removal, from small die or packaged devices through to 300mm wafers
Benefits of Oxford Instruments' Failure Analysis tools:
- Flexible processes using either RIE/PE or ICP platform
- Advanced die process: Etch rate 20 times faster than standard RIE processes using the Plasma Accelerator
- Flexible tools offering a whole range of processes
Range of Failure Analysis tools available from Oxford Instruments Plasma Technology
- PlasmaProTM FA300 - a dual-mode RIE/PE tool for 300mm wafer processing
- PlasmaPro NGP FA 200 ICP - a fast and low damage tool for small die and packaged devices
- PlasmaPro NGP FA200 - a dual-mode for 200mm wafer processing
- TEOS - process for gap fill
Oxford Instruments Plasma Technology also offers process support both in house and in field, and actively supports customer process development. Please contact us for more details.